Call for Papers

HIPS 2027: The 32nd International Workshop on High-Level Parallel Programming Models and Supportive Environments

To be held in conjunction with IPDPS 2027

Seattle, Washington, USA

Introduction

The 32nd HIPS workshop, to be held as a full-day meeting at the IEEE IPDPS 2027 conference in Seattle, Washington, USA, focuses on high-level programming of multiprocessors, compute clusters, and massively parallel machines. Like previous workshops in this series, which was established in 1996, this event serves as a forum for research in the areas of parallel applications, language design, compilers, runtime systems, and programming tools. It provides a timely forum for scientists and engineers to present the latest ideas and findings in these rapidly changing fields. In our call for papers, we especially invite papers demonstrating innovative approaches in the areas of emerging programming models for large-scale parallel systems and many-core architectures.

Topics of the Workshop

Topics of interest to the HIPS workshop include but are not limited to:

High-level and domain-specific programming systems
Language/compiler support for AI/ML and Cybersecurity/Privacy (e.g., ML-based autotuning)
Application of Agentic AI in high-level programming environments
Higher-level programming support for quantum computing/quantum simulation
Programming Models and Tools for the Edge-Cloud-HPC Continuum
(Scalable) programming tools and tools for power & performance analysis, modeling, monitoring and debugging, and core correctness
Compiler analysis and optimization techniques
OS and architectural support for parallel programming and debugging
Software and system support for extreme scalability including fault tolerance and power-aware HPC
Programming environments for heterogeneous multicore systems and accelerators such as GPUs, FPGAs and RISC-V
Solutions for programming paradigms from different hardware vendors
Performance portability
Efforts for improving the sustainability of scientific software
Languages and runtime support for multi-science/coupled codes, including but not limited to ensemble computing and uncertainty quantification
Static and dynamic analysis for bug detection of parallel and distributed programs

Important Dates

Abstract submission deadline: January 18, 2027, Anywhere on Earth (AoE)
Paper submission deadline: January 22, 2027, Anywhere on Earth (AoE)
Notification of acceptance: February 21, 2027 AoE
Camera-ready papers due: March 6, 2027, AoE
Workshop day: TBA (IPDPS 2027 dates TBA)

(Dates may be adjusted based on the IPDPS 2027 schedule.)

Manuscript Submission

Authors are invited to submit original papers in two separate tracks:

Full papers may not exceed 10 single-spaced double-column pages using 10-point size font on 8.5x11 inch pages (IEEE conference style), including figures, tables, and references. The authors, if accepted, will have the opportunity to present their work during the workshop.

Short papers may not exceed 4 single-spaced double-column pages using 10-point size font on 8.5x11 inch pages (IEEE conference style), including figures, tables, and references. The authors, if accepted, will have the opportunity to give a short presentation during the workshop.

All submissions should be formatted according to the IPDPS paper style (IEEE conference style, single-blind).

Please submit papers through the HIPS Linklings site

Proceedings

The accepted full papers will be published in the IPDPS 2027 Workshops proceedings by the IEEE Xplore Digital Library. (Short papers will not appear in the proceedings.) Presentation of an accepted paper at the conference is a requirement of publication. Any paper that is not presented at the conference will not be included in IEEE Xplore.

Organizers (Contact Us)

Doru Thom Popovici, Lawrence Berkeley National Lab, California, USA (dtpopovici@lbl.gov)
Yi Ju, Technical University of Munich, Munich, Germany (yi.ju@tum.de)

Steering Committee

Rudolf Eigenmann, University of Delaware, USA
Michael Gerndt, Technical University of Munich, Germany
Frank Mueller, North Carolina State University, USA
Martin Schulz, Technical University of Munich, Germany